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Turning difficult surfaces into perfect partners for inking, coating, laminating, and film deposition.
Through low-pressure (vacuum) plasma cleaning, activation, micro-etching, and deoxidation, we effectively enhance surface energy and hydrophilicity, strengthening adhesion performance in subsequent sputtering, printing, coating, and lamination processes.
Three Key Values
Three Key Values
Achieve better adhesion and printing
Achieve better adhesion and printing
Enhanced surface energy, smooth and uniform coating, with less delamination and orange peel.
Consistent production
Consistent production
Programmable and fully traceable process parameters ensure uniform treatment and stable yield.
Eco-friendly process
Eco-friendly process
Low thermal load, solvent-free/VOC-free, safer for both personnel and the environment.
Production Capabilities & Advanced Equipment
Production Capabilities & Advanced Equipment
Our Process
Our Process
Vacuum pumping
Establish a stable chamber pressure and low-contamination environment
Gas introduction
Select Ar, O₂, N₂, or their combination based on target properties
DC pre-treatment plasma ignition
Active species clean, activate, and micro-etch the substrate surface
Exhaust & rewinding
Remove by-products; continuous processing ensures consistent results
Product Packaging
The products are vacuum-sealed to prevent oxidation and contamination, thereby extending their shelf like and maintaining usability.
Quality Verification & Standards
Quality Verification & Standards
Applicable Substrates & Applications
Applicable Substrates & Applications
Why Choose EFUN Technology
Why Choose EFUN Technology
Vacuum environment
Vacuum environment
Reduces contamination and humidity interference for higher uniformity
Low-thermal process
Low-thermal process
Preserves transparency and dimensional stability of materials
Engineered implementation
Engineered implementation
DOE-optimized parameters, measurement reports, mass-production SOPs, and audit support
Get Started Today
Get Started Today
Send us your information
Send us your information
Substrate/material type & thickness, target dyne level or adhesion grade, expected line speed & web width, and downstream process (sputtering, coating, or lamination).
※ We will provide a tailored sampling plan and schedule within 48 hours. Let's help you achieve superior surface performance and reliable production!
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